Product Description
The AXU2CGB-I development board equipped with the AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, DP, M.2, USB 3.0, CAN, RS485, MIPI, UART.
Provide high-speed storage (M.2) and video applications (DP).
Applications
● Artificial Intelligence
● Automotive
● AV Broadcasting
● Deep learning
● Digital Signal Processing
● 5G Wireless and Wire Communication
● Data Centers
● Drive / Motion Control
● Industrial Internet of Thing
● Cloud Computing Security
● Machine Vision
● Medical Endoscop
● Video and Image Processing
Key Features
System-on-Module
● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC:
◆ ARM® dual-core Cortex™-A53 up to 1.2 GHz
◆ ARM® dual-core Cortex™-R5F up to 533 MHz
◆ 16nm FinFET+ FPGA fabric
● Pluggable module with 4 x Panasonic board-to-board connectors
● 4GByte DDR4 SDRAM on PS
● 1GByte DDR4 SDRAM on PL
● 32MB QSPI Flash
● 32GB eMMC FlashBase Board
● 1 x M.2 Card slot on PS
● 1 x DP Interface on PS
● 1 x 2 lane MIPI on PL
● 2 x CAN on ps
● 2 x RS485 on PL
● 2 x USB3.0 on PS + 2 x USB2.0 on PS
● EEPROM: 4-Kbit I2C Serial EEPROM + 1 x Temperature sensor (LM75)
● 2 x Gigabit Ethernet (1 x PS + 1 x PL)
● 2 x UART (1 x PS + 1 x PL) (USB to UART)
● 1 x Micro SD
● 1 x RTC (Real-time clock)
● 2 x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.)
● LED (1 x pwr + 1 x PL + 1 x PS) + KEY (1 x RST + 1 x PS + 1 x PL)
● 12V single supply
● Dimensions: 160 x 100 mm form factor
Development Board Features
Featuring the AMD/Xilinx's Zynq™ UltraScale+™ MPSoC XCZU2CG-1SFVC784I Adaptive SoC
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ MPSoC based application.
* The AXU2CGB-E development board consists of a ACU2CG-I SoM and base board. If you want to purchase ACU2CG-I SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX AMD Xilinx Zynq™ UltraScale+™ MPSoC XCZU2CG development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
| System-on-Module | 1 | Base Board | 1 |
|---|---|---|---|
| Heatsink Kit (preinstalled) | 1 | USB Downloader Cable / set | 1 Set |
| 12V Power Adapter | 1 | Acrylic board | 1 |
| Mini USB Cable | 1 | Card Reader | 1 |
| TF Card | 1 |
